Job Description:
· Lead the Equipment Section to maintain high team morale and deliver strong KPIs and sustainable long-term performance.
· Ensure compliance with MRB, TECN, 8D, specifications, and QMS tools (SPC, FMEA) to enable timely issue detection and effective resolution.
· Drive risk management and continuous improvement initiatives to prevent quality, yield, and excursion issues.
· Define targets and lead improvement projects to reduce wafer scrap, defects, and rework, while improving process capability.
· Track and ensure project execution aligns with fab performance and operational requirements.
· Forecast and manage equipment repair and management budgets while driving cost optimization initiatives.
· Collaborate with Process and Manufacturing teams to resolve equipment constraints, improve OEE, and optimize metrology sampling.
· Manage vendor performance to enhance quality, cost efficiency, and service support.
· Ensure full compliance with EHS standards and maintain high housekeeping practices.
· Oversee spare parts inventory control and forecast usage to ensure availability and cost efficiency.
· Set clear performance expectations, conduct regular reviews, and support team capability development and career progression.
· Ensure effective training, competency development, and proper documentation of technical knowledge.
Requirements:
· Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
· 8 years of relevant work experience in Thin Film CMP Equipment.
· Min 5 years of proven track record in a managerial role with strong leadership capabilities.
· An excellent team player with good interpersonal, communication and written skills
· High level of integrity with strong leadership attributes to lead and coach a team
· Highly committed with good ownership and accountability
· Able to adapt in a fast-paced environment and work under pressure
· Proficient in MS Office Applications and good data analytical skill.