Job Descriptions
Job Requirements
· Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
· 2 or more years of semiconductor equipment or process engineering experience preferably Wafer bonder and Sam coat machines
· Develop ,implement and sustain preventive & predictive maintenance strategies to maximize uptime and performance
· Execute equipment upgrades and minor hardware modifications to improve tool capability and reliability & operational efficiency
· Willing to learn and adopt & Tenacity to work effectively under timelines and limited resources
· Consistent track record to solve problems & address root causes
· Perform Normal/ Swing Shift ( or 12-hour rotating shift if required)
· Good interpersonal skills and is an excellent team player
· Good verbal and written communication skills
· Logical thinking capability and good analytical skill
Browser back button is disabled for navigation
Your page will expire in .